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Hong Kong Head Office Address:
Room 211, International Trade
Centre, 11-19 ShaTsuiRoad,
TsuenWan, Hong Kong.
Tel: (852) 2437 2839
Fax: (852) 2437 2898
(852) 2499 3995
Website: www.plotter-china.com
Email: info@worldstar-ind.com
sales@worldstar-ind.com

Sales Representative in Germany
EURASIA DEUTSCHLAND GmbH
Meisenweg 1 35415 Pohlheim Germany
Tel: +49 (0) 6404-6570530
Fax: +49 (0) 6404-6570532
Website: www.eur-asia.de
Email: info@eur-asia.de

Sales Representative in France
Lotus Technologies 927. avenue Joliot Curie, ZI Sanit-Cesaire 30900 Nimes, (France)
Tel: 04 66 62 00 62
Fax: 04 66 68 19 47
Contact person: Mr. Fred Perrier
Email: lotustechnologie@wanadoo.fr

 

 

  • Technology


  • No.
    Process
    Equipment
    1. Pre-Production
  • CAD/CAM
  • Laser photoplotter
  • Developer
    2. Cut Sheet
  • Board cut machine
  • Board edge shaving machine
  • Cleaning machine
    3. Inner image Transfer
  • Inner layer scrubbing and chemical pre-treatment machine
  • Dry film laminator
  • Collimated exposure
  • Developer, etching and stripping machine
  • Automatic optical inspector
    4. Pressing
  • Automatic brown oxide line
  • Vacuum pressing machine
  • X-ray target-hole machine
    5. Drilling
  • CNC drilling machine
    6. PTH and panel plating
  • Automatic desmear and PTH line
  • Automatic panel plating line
    7. Outer image transfer
  • Automatic hot roll laminator
  • Automatic collimated UV exposure
  • Automatic pattern plating line
  • Film strpping, etching and Tin-stripping
    No.
    Process
    Equipment
    8. Solder mask / silkscreen
  • Vocalo-ash scrubbing machine
  • Solder mask double-printing machine
  • Exposure
  • Solder mask solder mask
    9. Plating and Surface treating
  • Automatic flash Nickle/Gold line
  • Automatic immersion Gold?line
  • H.A.S.L machine
  • Organic coating line (Entek)
    10. Profile
  • CNC routing machine
  • Tooling Punching
  • CNC V-cutting
    11. E-testing packing
  • Flying probe tester
  • Universal tester
  • Dedicated high voltage tester
  • Vacuum packing machine

    * Chemical lab and Physical lab
    • Impedance tester
    • X-ray thickness measure
    • Metallography
    • Ionic contamination tester
    • Peel Strength tester
    • Copper thickness terter
    • UV spectro photometer

  • Technology Ability


  • Min. Line Width 4 mil
    Min. Space 4 mil
    Min. pad PTH 4 mil
      Min. hole diameter
    Board thickness:
    <0.4mm 0.20mm
    Board thickness:
    0.4~1.0mm 0.25mm
    Board thickness:
    > 1.0mm 0.30mm
      Maximium. Board Thickness
    Single/Double Layers 3.2mm
    Multi-Layers 5.0 mm
      Minimium Board Thickness
    Single/Double Layers 0.2mm
    4 Layers 0.4mm
    6 Layers 0.8mm
    8 Layers 1.0mm
    10 Layers 1.2mm
    Distance Between the line and edge
    Milling – 0.2mm ; V-cut – 0.4mm
         
    Plating Thickness (microinches)
    - Gold Plating Ni 100 ~ 150
    Au 1 ~ 3
    - Chem Gold Ni 100 ~ 200
    Au 1 ~ 5
    - Gold Fingers Ni 120 ~ 150
    Au 5 ~ 30
    Hole Copper Cu 18 ~ 25 Micron
    Base Copper Cu 0.5 ~ 3 oz. Cu


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